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Insertion of HDI and Grid Array Technologies Into Military/Space Applications

[+] Author Affiliations
Jerry D. Keller

Honeywell Defense and Space Electronic Systems, Clearwater, FL

Paper No. IPACK2003-35248, pp. 783-788; 6 pages
doi:10.1115/IPACK2003-35248
From:
  • ASME 2003 International Electronic Packaging Technical Conference and Exhibition
  • 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 2
  • Maui, Hawaii, USA, July 6–11, 2003
  • Conference Sponsors: Electronic and Photonic Packaging Division
  • ISBN: 0-7918-3690-8 | eISBN: 0-7918-3674-6
  • Copyright © 2003 by ASME

abstract

As with the commercial market, Military/Aerospace electronic packaging has similar needs to develop smaller/lighter/ higher performance electronics. This need has required the use of High Density Interconnect (HDI) circuit boards and Grid Array components (ball and column) in rugged environment applications such as military and space. This discussion will cover the technology study program conducted by Honeywell Defense and Space Electronics Systems on the mechanical durability of HDI (High Density Interconnect) and Grid Array component packaging and its application into “Hi Rel” aerospace programs.

Copyright © 2003 by ASME

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