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A Review of the Economics of Embedded Passives

[+] Author Affiliations
Peter A. Sandborn

University of Maryland, College Park, MD

Paper No. IPACK2003-35339, pp. 757-762; 6 pages
  • ASME 2003 International Electronic Packaging Technical Conference and Exhibition
  • 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 2
  • Maui, Hawaii, USA, July 6–11, 2003
  • Conference Sponsors: Electronic and Photonic Packaging Division
  • ISBN: 0-7918-3690-8 | eISBN: 0-7918-3674-6
  • Copyright © 2003 by ASME


This paper provides an overview of the economic issues and cost models associated with the conversion of discrete passives to embedded passives in printed circuit boards. Three attributes of economic analysis are included herein: fabrication and manufacturing cost analyses, embedded resistor trim and rework economics, and non-manufacturing life cycle costs that are impacted by the conversion of discrete passives to embedded passives. In addition, a complete set of references to existing work on the economics of embedded passives is provided.

Copyright © 2003 by ASME
Topics: Economics



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