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Influence of Package-Sink Interface Materials on Die Performance and Reliability

[+] Author Affiliations
Henry H. Jung, Sai Ankireddi, Stanley Pecavar, James Jones

Sun Microsystems, Inc., Sunnyvale, CA

Paper No. IPACK2003-35304, pp. 641-645; 5 pages
doi:10.1115/IPACK2003-35304
From:
  • ASME 2003 International Electronic Packaging Technical Conference and Exhibition
  • 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 2
  • Maui, Hawaii, USA, July 6–11, 2003
  • Conference Sponsors: Electronic and Photonic Packaging Division
  • ISBN: 0-7918-3690-8 | eISBN: 0-7918-3674-6
  • Copyright © 2003 by ASME

abstract

For high-power electronic packages, it is generally accepted that the package-sink interface materials used in the thermal solution influence hot-spot temperature(s) and junction-to-ambient thermal resistance. In this article we show how these package-exterior materials can noticeably influence across-die temperature gradients also. The numerical results reveal that the across-die thermal gradient can nearly double over a narrow range of conductivities typical of commercially available package-sink interface materials. Results show that the chip hot-spot temperature can be reduced 4 to 7 C by increasing the thermal interface material conductivity from 1 to 3 W/mk. This improvement can reduce the total thermal resistance from chip to ambient.

Copyright © 2003 by ASME

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