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Experiments and Modeling of the Thermal Resistance of In-Line Square Pin-Fin Heat Sinks With Top By-Pass Flow

[+] Author Affiliations
Mario Urdaneta, Alfonso Ortega

University of Arizona, Tucson, AZ

Paper No. IPACK2003-35270, pp. 597-604; 8 pages
doi:10.1115/IPACK2003-35270
From:
  • ASME 2003 International Electronic Packaging Technical Conference and Exhibition
  • 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 2
  • Maui, Hawaii, USA, July 6–11, 2003
  • Conference Sponsors: Electronic and Photonic Packaging Division
  • ISBN: 0-7918-3690-8 | eISBN: 0-7918-3674-6
  • Copyright © 2003 by ASME

abstract

The thermal resistance of in-line square-pin fin heat sinks was experimentally investigated. In a companion paper [1], extensive results for the hydraulic behavior of such heat sinks with and without top-bypass were reported. It was shown that the top-bypass, as well as pin pitch, strongly influence the fin flow available for cooling. Systematic measurements of the overall thermal resistance with a uniformly heated base were performed for the same set of twenty aluminum heat sinks. Pin height was varied from 12.5 mm to 22.5 mm, pin pitch was varied from 3.4 mm to 6.33 mm, and base dimensions were kept fixed at 25 × 25 mm. The overall base to ambient thermal resistance was measured as a function of heat sink geometry, approach velocity and by-pass height. Experimental results were compared with predictions based on a simple one-dimensional “two-branch bypass model”. It was found that the overall heat transfer is governed by the fin flow, hence, empirical data for the zero bypass case can be used to predict the decrease of heat sink performance with flow bypass.

Copyright © 2003 by ASME

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