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Benchmark Heat Transfer Data for Micro-Structured Surfaces for Immersion Cooled Microelectronics

[+] Author Affiliations
Nitesh D. Nimkar, Sushil H. Bhavnani, Richard C. Jaeger

Auburn University, Auburn, AL

Paper No. IPACK2003-35267, pp. 575-585; 11 pages
doi:10.1115/IPACK2003-35267
From:
  • ASME 2003 International Electronic Packaging Technical Conference and Exhibition
  • 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 2
  • Maui, Hawaii, USA, July 6–11, 2003
  • Conference Sponsors: Electronic and Photonic Packaging Division
  • ISBN: 0-7918-3690-8 | eISBN: 0-7918-3674-6
  • Copyright © 2003 by ASME

abstract

Pool boiling from a surface featuring micro-pyramidal re-entrant cavities (mouth size 40 μm) etched in silicon, on a glass substrate, was studied. All experiments were conducted in the dielectric fluid FC-72 at one atmosphere. The heat sink is designed to eliminate spreading through the substrate, and back heat loss. Experimentation showed that the critical heat flux was 12.8 W/cm2 . A high speed camera (400fps) was used to record and quantify the effect of heat flux on departure diameter and bubble emission frequency. Both departure diameter and frequency showed an increasing trend with heat flux. Comparison with existing literature are also presented.

Copyright © 2003 by ASME

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