0

Full Content is available to subscribers

Subscribe/Learn More  >

Reverse Mount Packages and Their Cooling

[+] Author Affiliations
Mudasir Ahmad, Susheela Narasimhan

Cisco Systems, Inc., San Jose, CA

Paper No. IPACK2003-35231, pp. 461-466; 6 pages
doi:10.1115/IPACK2003-35231
From:
  • ASME 2003 International Electronic Packaging Technical Conference and Exhibition
  • 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 2
  • Maui, Hawaii, USA, July 6–11, 2003
  • Conference Sponsors: Electronic and Photonic Packaging Division
  • ISBN: 0-7918-3690-8 | eISBN: 0-7918-3674-6
  • Copyright © 2003 by ASME

abstract

The density of packaging in electronic enclosures is increasing rapidly and the real estate available for packaging high power ASICs and processors is decreasing very rapidly as well. This work presents a study where packages are mounted below the board and the ASICs are cooled using the sheet metal tray as the heat spreader. The heat is transferred from the processor or the chip to the sheet metal tray through metallic blocks or heat spreaders by conduction and then the sheet metal tray is cooled convectively by airflow between two successive boards. There are various issues to be encountered when we do such a design for reverse mount packages like the maximum stress exerted on the ASIC, the kind of interface material that should be used to minimize the stress induced on the ASIC and also keeping in mind the thermal impedance of the interface material. The study presents simulation and experimental results that illustrate the concept of using the sheet metal tray as a heat spreader and also discuss potential applications of this concept. Considerations and precautions to be taken while executing this concept are also addressed.

Copyright © 2003 by ASME

Figures

Tables

Interactive Graphics

Video

Country-Specific Mortality and Growth Failure in Infancy and Yound Children and Association With Material Stature

Use interactive graphics and maps to view and sort country-specific infant and early dhildhood mortality and growth failure data and their association with maternal

NOTE:
Citing articles are presented as examples only. In non-demo SCM6 implementation, integration with CrossRef’s "Cited By" API will populate this tab (http://www.crossref.org/citedby.html).

Some tools below are only available to our subscribers or users with an online account.

Related Content

Customize your page view by dragging and repositioning the boxes below.

Related eBook Content
Topic Collections

Sorry! You do not have access to this content. For assistance or to subscribe, please contact us:

  • TELEPHONE: 1-800-843-2763 (Toll-free in the USA)
  • EMAIL: asmedigitalcollection@asme.org
Sign In