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Control of a Laboratory-Based Thermal Management System

[+] Author Affiliations
Mark H. McKinney

The Citadel, Charleston, SC

Charles Wall

Kyro Tech

Paper No. IPACK2003-35198, pp. 417-421; 5 pages
  • ASME 2003 International Electronic Packaging Technical Conference and Exhibition
  • 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 2
  • Maui, Hawaii, USA, July 6–11, 2003
  • Conference Sponsors: Electronic and Photonic Packaging Division
  • ISBN: 0-7918-3690-8 | eISBN: 0-7918-3674-6
  • Copyright © 2003 by ASME


In a laboratory environment, flexible, accurate and reliable thermal management is critical to successful analysis and testing of a single package IC device under test (DUT). As next generation electronic components approach a heat flux of 200W/cm2 , the control aspects of the thermal management system become even more critical. Utilizing advanced vapor-compression refrigeration technology in conjunction with PID control algorithms, accurate thermal management of a DUT is achieved. In order to accurately control the temperature, the control system monitors case (TC ), evaporator (TE ), or internal junction (TJ ) temperature and employs real time pulse width modulation control of refrigerant flow to achieve accurate control to less than ±3°C. The system also includes the capability to monitor the actual power supplied to the DUT and is capable of control up to a thermal load of 200W. This paper presents the requirements for and the design of the thermal control system utilized in a high heat-flux, laboratory-based thermal management system.

Copyright © 2003 by ASME



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