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Automatic Thermal Modeling for System Level Design of Electronic Equipment

[+] Author Affiliations
Kenichiro Aoki, Koichi Shimizu, Akira Ueda, Akira Tamura, Masanori Motegi

Fujitsu, Ltd., Kawasaki, Japan

Paper No. IPACK2003-35161, pp. 357-362; 6 pages
  • ASME 2003 International Electronic Packaging Technical Conference and Exhibition
  • 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 2
  • Maui, Hawaii, USA, July 6–11, 2003
  • Conference Sponsors: Electronic and Photonic Packaging Division
  • ISBN: 0-7918-3690-8 | eISBN: 0-7918-3674-6
  • Copyright © 2003 by ASME


The development of hardware needs cost reduction by shortening a development period and reducing experimental man-hour. In order to satisfy these demands, thermal fluid analysis with higher accuracy in short time is indispensable for product development. At present, thermal fluid analyses are conducted using different software tools. Each software tool requires model building and meshing for simulations using its own format. That leads to a large investment in time, and therefore cost. VPS/Simulation-Hub software Fujitsu developed is able to convert data from various CADs. It has the features to create a data fitting to numerical analysis software, create an accurate analysis model, and delete unnecessary components. With these main features, VPS/Simulation-Hub greatly contributes to the man-hour reduction for model building and the improvement of analytical accuracy. In this paper, VPS/Simulation-Hub is introduced with the detail explanation of the above 3 main features.

Copyright © 2003 by ASME



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