Full Content is available to subscribers

Subscribe/Learn More  >

Performance Comparison of Mesoscale Refrigeration Technologies for Electronics Packaging

[+] Author Affiliations
Patrick E. Phelan

Arizona State University, Tempe, AZ

Victor Chiriac, Tien-Yu Tom Lee

Motorola, Inc., Tempe, AZ

Paper No. IPACK2003-35140, pp. 309-315; 7 pages
  • ASME 2003 International Electronic Packaging Technical Conference and Exhibition
  • 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 2
  • Maui, Hawaii, USA, July 6–11, 2003
  • Conference Sponsors: Electronic and Photonic Packaging Division
  • ISBN: 0-7918-3690-8 | eISBN: 0-7918-3674-6
  • Copyright © 2003 by ASME


Utilizing refrigeration is one alternative to improve the operating performance of microelectronic devices. Unless large-scale refrigeration systems are acceptable, it is likely that miniature, or mesoscale, refrigerators will be required that can be directly incorporated into electronic packaging. The present study builds on the authors’ previous investigation of mesoscale refrigerators, which emphasized how only thermoelectric coolers (TEC’s) are capable of being miniaturized in the near future. Many other refrigeration systems, however, are being examined for their potential to be miniaturized, including the vapor-compression, Stirling, and pulse-tube cycles. Here a simple analysis is presented that shows the feasibility of utilizing these systems in electronics packaging. One finding is that, provided a suitable mesoscale compressor can be constructed, a vapor-compression refrigerator may yield the best performance of the investigated systems.

Copyright © 2003 by ASME



Interactive Graphics


Country-Specific Mortality and Growth Failure in Infancy and Yound Children and Association With Material Stature

Use interactive graphics and maps to view and sort country-specific infant and early dhildhood mortality and growth failure data and their association with maternal

Citing articles are presented as examples only. In non-demo SCM6 implementation, integration with CrossRef’s "Cited By" API will populate this tab (http://www.crossref.org/citedby.html).

Some tools below are only available to our subscribers or users with an online account.

Related Content

Customize your page view by dragging and repositioning the boxes below.

Related eBook Content
Topic Collections

Sorry! You do not have access to this content. For assistance or to subscribe, please contact us:

  • TELEPHONE: 1-800-843-2763 (Toll-free in the USA)
  • EMAIL: asmedigitalcollection@asme.org
Sign In