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Heat Transfer in Triangular Microchannels

[+] Author Affiliations
J. Todd Dickey, Tung T. Lam

The Aerospace Corporation, El Segundo, CA

Paper No. IPACK2003-35133, pp. 303-307; 5 pages
  • ASME 2003 International Electronic Packaging Technical Conference and Exhibition
  • 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 2
  • Maui, Hawaii, USA, July 6–11, 2003
  • Conference Sponsors: Electronic and Photonic Packaging Division
  • ISBN: 0-7918-3690-8 | eISBN: 0-7918-3674-6
  • Copyright © 2003 by ASME


A numerical heat transfer solution is compared with an analytical solution for a microchannel flow. The analytical derivation is based upon the porous material assumption as put forth by various investigators. While extensive work exists for the rectangular microchannel cross sectional area, other cross sections have not received the same attention. It is the intent of this paper to investigate the applicability of the porous material assumption to a triangular “saw tooth” cross section microchannel with respect to heat transfer and fluid flow characteristics. The results are presented in nondimensionalized form applicable to any fluid and geometric aspect ratio combination presented herein.

Copyright © 2003 by ASME



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