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Temperature Distribution in Two-Layered Composites

[+] Author Affiliations
Wing K. Yeung, Tung T. Lam

The Aerospace Corporation, El Segundo, CA

Paper No. IPACK2003-35131, pp. 293-302; 10 pages
  • ASME 2003 International Electronic Packaging Technical Conference and Exhibition
  • 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 2
  • Maui, Hawaii, USA, July 6–11, 2003
  • Conference Sponsors: Electronic and Photonic Packaging Division
  • ISBN: 0-7918-3690-8 | eISBN: 0-7918-3674-6
  • Copyright © 2003 by ASME


The thermal wave propagation behavior within a two-layered anisotropic substrate is investigated in this study using a two-dimensional hyperbolic heat conduction model. The governing equations are solved by a flux splitting algorithm based on the Godunov numerical scheme. Special attention is given to the nature of heat propagation and reflection within the composite substrate after an instantaneous release of energy. The influences of the thermal lagging behavior, anisotropic thermal conductivity, and material interfacial effect on temperature distributions are investigated. Comparisons are made between results obtained by the thermal diffusion and wave models.

Copyright © 2003 by ASME



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