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Thermal Behavior of Next Generation of Raman Pump Lasers in Telco Equipment

[+] Author Affiliations
Gamal Refai-Ahmed, Stephanie Trottier

Ceyba, Ottawa, ON, Canada

Paper No. IPACK2003-35129, pp. 285-292; 8 pages
doi:10.1115/IPACK2003-35129
From:
  • ASME 2003 International Electronic Packaging Technical Conference and Exhibition
  • 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 2
  • Maui, Hawaii, USA, July 6–11, 2003
  • Conference Sponsors: Electronic and Photonic Packaging Division
  • ISBN: 0-7918-3690-8 | eISBN: 0-7918-3674-6
  • Copyright © 2003 by ASME

abstract

The present investigation concluded that the thermal behavior of the laser diode can be numerically modeled using the parabolic transient conduction equation. In addition, the current study compared the thermal performance of the continuous wave pump lasers versus the modulated wave pump lasers. This comparison revealed that the temperature of the modulated wave pump laser can approach the temperature of the continuous wave pump laser with the same average power dissipation when the frequency approaches infinity. Finally, the resulting thermal behavior was correlated and expressed in an empirical form, which physically described the thermal performance of the modulating pump laser.

Copyright © 2003 by ASME
Topics: Lasers , Pumps

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