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Fluid Flow and Thermal Characteristics for a Microchannel Heat Sink Subject to an Impinging Jet

[+] Author Affiliations
Seok Pil Jang, Sung Jin Kim

Korea Advanced Institute of Science and Technology, Taejon, Korea

Paper No. IPACK2003-35114, pp. 263-270; 8 pages
doi:10.1115/IPACK2003-35114
From:
  • ASME 2003 International Electronic Packaging Technical Conference and Exhibition
  • 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 2
  • Maui, Hawaii, USA, July 6–11, 2003
  • Conference Sponsors: Electronic and Photonic Packaging Division
  • ISBN: 0-7918-3690-8 | eISBN: 0-7918-3674-6
  • Copyright © 2003 by ASME

abstract

In the present study fluid flow and heat transfer characteristics of a microchannel heat sink subject to an impinging jet are experimentally investigated. In order to evaluate the cooling performance of a microchannel heat sink subject to an impinging jet under the fixed pumping power condition, the pressure drop across a microchannel heat sink and temperature distributions at the base of it are measured. Especially, a micro-thermal sensor array is manufactured with simple and convenient microfabrication processes to measure temperature distributions at the base of the heat sink accurately. Based on these experimental results, we suggest a correlation for the pressure drop across a microchannel heat sink subject to an impinging jet as well as a correlation for the thermal resistance of that. In addition, we show that the cooling performance of a microchannel heat sink subject to an impinging jet is superior to that of the microchannel heat sink subject to a parallel flow.

Copyright © 2003 by ASME

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