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Performance Analysis, Optimum and Verification for Parallel Plate Heat Sink Associated With Single Non-Uniform Heat Source

[+] Author Affiliations
Vincent Lin

Inventec Corporation, Taoyuan, Taiwan

Sih-Li Chen

National Taiwan University, Taipei, Taiwan

Paper No. IPACK2003-35103, pp. 229-236; 8 pages
doi:10.1115/IPACK2003-35103
From:
  • ASME 2003 International Electronic Packaging Technical Conference and Exhibition
  • 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 2
  • Maui, Hawaii, USA, July 6–11, 2003
  • Conference Sponsors: Electronic and Photonic Packaging Division
  • ISBN: 0-7918-3690-8 | eISBN: 0-7918-3674-6
  • Copyright © 2003 by ASME

abstract

This paper develops an analytical model to predict the overall thermal resistance of a parallel plate heat sink associated with a non-uniform heat source. Using constrictive ratio and apparent interface ratio to interpret equivalent heat source area and maximal heat flux on source-to-sink contacting surface, the non-uniform heat source problem can be simplified as an equivalent uniform heat source problem. Then by using the existed correlations the present model can calculate the overall thermal resistance as a function of heat sink geometry, properties, interface conditions, and airflow velocity. An experimental investigation is performed to verify the theoretical model. Prediction results show good agreement with experimental measurements over a number of testing units. A case study of optimum is also proposed to demonstrate and understand the effects of variable constrictive ratio and apparent interface resistance.

Copyright © 2003 by ASME
Topics: Heat , Heat sinks

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