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Experimental Study of Innovative Heat Sinks for High Power Density Electronic Components

[+] Author Affiliations
Giampietro Fabbri, Marco Lorenzini

Università di Bologna, Bologna, Italy

Paper No. IPACK2003-35102, pp. 221-227; 7 pages
  • ASME 2003 International Electronic Packaging Technical Conference and Exhibition
  • 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 2
  • Maui, Hawaii, USA, July 6–11, 2003
  • Conference Sponsors: Electronic and Photonic Packaging Division
  • ISBN: 0-7918-3690-8 | eISBN: 0-7918-3674-6
  • Copyright © 2003 by ASME


In this work, some simple air-cooled high-effectiveness heat sinks are proposed for the cooling of electronic devices such as microprocessors for personal computers. The performance of the heat sinks are experimentally investigated. In particular the temperature of the heat sink surface in contact with the devices to be cooled is measured together with the air temperature and flow, by varying the air flow rate. The pressure drop in the air through the heat sinks is also measured. The thermal resistance of the disspators is then calculated and compared to that of commercially available heat sinks.

Copyright © 2003 by ASME



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