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The Dynamic Inverse Method for Thermal Resistance of Cooling Device

[+] Author Affiliations
Heng-Chieh Chien, Ming-Hsi Tseng, Wen-Yang Chang

Industrial Technology Research Institute (ITRI), Hsinchu, Taiwan

Paper No. IPACK2003-35097, pp. 207-210; 4 pages
  • ASME 2003 International Electronic Packaging Technical Conference and Exhibition
  • 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 2
  • Maui, Hawaii, USA, July 6–11, 2003
  • Conference Sponsors: Electronic and Photonic Packaging Division
  • ISBN: 0-7918-3690-8 | eISBN: 0-7918-3674-6
  • Copyright © 2003 by ASME


A dynamic inverse method for measuring the thermal resistance of cooling device is described. The cooling device is held on a heat capacity block and heating the block higher than environment 50°C, then the thermal resistance of cooling device is deduced from the exponential decay in the temperature difference between the heat capacity block and the environment. This technique is different from conventional measurement in two ways. First, the thermal resistance is usually measured under steady state and always required much time, thus the dynamic measuring technique is needed. Second, the power of heater is always needed to control at a certain value exactly but it isn’t in inverse method. The result reveal that the test time is reduced from several tens minutes to few minutes and made to an accuracy of about ±2%. This rapid and reliable measurement technique is possible used in-line testing of cooling devices for industrial application.

Copyright © 2003 by ASME



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