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Thermal Modeling of Plated-Through Hole Vias in a FBGA Package

[+] Author Affiliations
X. Howard Sun, R. Sahan

Fluent, Inc., Santa Clara, CA

Z. Zhao

Broadcom Corporation, Irvine, CA

Paper No. IPACK2003-35092, pp. 201-206; 6 pages
doi:10.1115/IPACK2003-35092
From:
  • ASME 2003 International Electronic Packaging Technical Conference and Exhibition
  • 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 2
  • Maui, Hawaii, USA, July 6–11, 2003
  • Conference Sponsors: Electronic and Photonic Packaging Division
  • ISBN: 0-7918-3690-8 | eISBN: 0-7918-3674-6
  • Copyright © 2003 by ASME

abstract

The objective of this study is to compare different geometric models to represent thermal vias (plated though holes - PTH) in the substrate of a 196-ball FBGA package. The baseline model, which models each via individually as PTHs, was compared with models that model each via individually by solid cylinders and square cross-section prismatic blocks, and a compact model that models all vias by one prismatic block. The computational fluid dynamics (CFD) simulations were carried out using Icepak®. It was found that all simplifications led to some degree of under-prediction of the junction temperature. The results showed that the detailed models with the cylindrical cross-section and the square cross-section under-predicted the junction temperature by about 3–4% compared to the baseline model. The compact model, however, under-predicted the junction temperature by about 10% compared to the baseline model. The explanation for this error produced by the compact model is that it cannot model the constriction effect of the small individual thermal vias. The conclusion of this study is that all simplifications led to some degree of under-prediction of the junction temperature, and the popular technique to model the thermal vias by a block can lead to appreciable errors in predicting the die temperature.

Copyright © 2003 by ASME

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