0

Full Content is available to subscribers

Subscribe/Learn More  >

Effective Thermophysical Properties of Thermal Interface Materials: Part I — Definitions and Models

[+] Author Affiliations
I. Savija, J. R. Culham, M. M. Yovanovich

University of Waterloo, Waterloo, ON, Canada

Paper No. IPACK2003-35088, pp. 189-200; 12 pages
doi:10.1115/IPACK2003-35088
From:
  • ASME 2003 International Electronic Packaging Technical Conference and Exhibition
  • 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 2
  • Maui, Hawaii, USA, July 6–11, 2003
  • Conference Sponsors: Electronic and Photonic Packaging Division
  • ISBN: 0-7918-3690-8 | eISBN: 0-7918-3674-6
  • Copyright © 2003 by ASME

abstract

The conductivity of thermal interface materials are typically determined using procedures detailed in ASTM D 5470. The disadvantages of using these existing procedures for compliant materials are discussed along with a proposed new procedure for determining thermal conductivity and Young’s modulus. The new procedure, denoted as the Bulk Resistance Method, is based on experimentally determined thermal resistance data and an analytical model for thermal resistance in joints incorporating thermal interface materials. Two versions of the model are presented, the Simple Bulk Resistance Model, based on the interface material thickness prior to loading and a more precise version denoted as the General Bulk Resistance Model, that includes additional parameters such as surface characteristics and thermophysical properties of the contacting solids. Both methods can be used to predict material in situ thickness as a function of load.

Copyright © 2003 by ASME

Figures

Tables

Interactive Graphics

Video

Country-Specific Mortality and Growth Failure in Infancy and Yound Children and Association With Material Stature

Use interactive graphics and maps to view and sort country-specific infant and early dhildhood mortality and growth failure data and their association with maternal

NOTE:
Citing articles are presented as examples only. In non-demo SCM6 implementation, integration with CrossRef’s "Cited By" API will populate this tab (http://www.crossref.org/citedby.html).

Some tools below are only available to our subscribers or users with an online account.

Related Content

Customize your page view by dragging and repositioning the boxes below.

Related eBook Content
Topic Collections

Sorry! You do not have access to this content. For assistance or to subscribe, please contact us:

  • TELEPHONE: 1-800-843-2763 (Toll-free in the USA)
  • EMAIL: asmedigitalcollection@asme.org
Sign In