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Thermal Analysis of Natural Convection Cooled Switch Mode Power Supplies

[+] Author Affiliations
Katsuhiro Koizumi, Akito Joboji, Kuniaki Nagahara

COSEL Company, Ltd., Toyama, Japan

Masaru Ishizuka

Toyama Prefecture University, Toyama, Japan

Paper No. IPACK2003-35048, pp. 103-109; 7 pages
doi:10.1115/IPACK2003-35048
From:
  • ASME 2003 International Electronic Packaging Technical Conference and Exhibition
  • 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 2
  • Maui, Hawaii, USA, July 6–11, 2003
  • Conference Sponsors: Electronic and Photonic Packaging Division
  • ISBN: 0-7918-3690-8 | eISBN: 0-7918-3674-6
  • Copyright © 2003 by ASME

abstract

This paper describes an application example of thermal flow simulation to the design of a switch mode power supply (SMPS) that is natural convection air-cooled. In this analysis, the modeling of printed circuit board (PCB) and power semiconductor devices was examined using the design of experiments method. The PCB was treated as a simple plate, and average thermal conductivity was not considered. The power semiconductor devices were modeled as a simple hexahedral resistive network block. As the heat generation sources, a field effect transistor (FET) and a diode were considered in the simulation, and the calculation method of power loss is described. The difference between measured and calculated values for power semiconductor devices was found to be within approximately 10 K.

Copyright © 2003 by ASME

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