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Optimization of Elliptical Fin Heat Sink Design in Forced Convection: Single and Multiple Heat Sink Scenarios

[+] Author Affiliations
Subha M. Kadangode

Radian/Intricast, Santa Clara, CA

John R. Mason

Cisco Systems, San Jose, CA

Paper No. IPACK2003-35029, pp. 89-96; 8 pages
  • ASME 2003 International Electronic Packaging Technical Conference and Exhibition
  • 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 2
  • Maui, Hawaii, USA, July 6–11, 2003
  • Conference Sponsors: Electronic and Photonic Packaging Division
  • ISBN: 0-7918-3690-8 | eISBN: 0-7918-3674-6
  • Copyright © 2003 by ASME


A parametric evaluation of elliptical pin fin heat sinks was performed using a commercially available CFD software package. The investigation involved variation of fin length, fin height, fin gap width, and air velocity while holding the heat flux and fin geometry as constants. The effect of these variables on the thermal performance and airflow impedance characteristics of the heat sink was studied and an optimum heat sink design was selected for a given set of conditions. Additionally, an often-encountered user requirement of multiple heat sinks in a row was also studied with these variables. In line and staggered elliptical fins as well as plate or extruded fins were analyzed although the main focus of the evaluation was based upon in line elliptical fins.

Copyright © 2003 by ASME



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