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Thermal Management of QFN 48 Package Attached to Different Multi-Layers of Printed Circuit Board Designs

[+] Author Affiliations
John Chia

Kao Yuan Institute of Technology, Kaohsiung, Taiwan

Charles Yang

International Semiconductor Technology, Ltd., Kaohsiung, Taiwan

Paper No. IPACK2003-35008, pp. 57-61; 5 pages
doi:10.1115/IPACK2003-35008
From:
  • ASME 2003 International Electronic Packaging Technical Conference and Exhibition
  • 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 2
  • Maui, Hawaii, USA, July 6–11, 2003
  • Conference Sponsors: Electronic and Photonic Packaging Division
  • ISBN: 0-7918-3690-8 | eISBN: 0-7918-3674-6
  • Copyright © 2003 by ASME

abstract

A near CSP plastic encapsulated package with a quad flat non-leaded (QFN) structure has been drawn much attention due to it small size and lightweight applications. Thermal efficiency is the major concern for adopting such type of package in place of TSSOP package. The thermal dissipation for electronics with the higher power consumption is current developing to it uppermost limitation as a wire bonded, lead-frame substrate type of QFN with various pine counts and body sizes. It is therefore an object of the present study to investigate thermal performance of QFN package optimum design attached on different layers and thickness of laminated printed circuit board (PCB), which is further related to reliability issue of this type of IC package. Numerical simulation illustrates how the thermal efficiency of the QFN package can be reached with different PCB designs and airflow conditions.

Copyright © 2003 by ASME

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