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Design Optimization of a Router Board Using Computational Fluid Dynamics

[+] Author Affiliations
Timothy J. Dake, Joseph Majdalani

Marquette University, Milwaukee, WI

Susheela Narasimhan

Cisco Systems, San Jose, CA

Paper No. IPACK2003-35338, pp. 35-39; 5 pages
doi:10.1115/IPACK2003-35338
From:
  • ASME 2003 International Electronic Packaging Technical Conference and Exhibition
  • 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 2
  • Maui, Hawaii, USA, July 6–11, 2003
  • Conference Sponsors: Electronic and Photonic Packaging Division
  • ISBN: 0-7918-3690-8 | eISBN: 0-7918-3674-6
  • Copyright © 2003 by ASME

abstract

The cooling of boards and components in telecommunication chassis is becoming progressively more challenging as the power dissipation of the components increases. The internet market is demanding higher speeds and the internet gear makers try to accommodate the increasing demand of the consumer. Hence there are situations where the power requirement for one rack unit of the chassis is reaching 500–600 W currently and expected to reach about 800–1000 W in 1–2 years. The power dissipations on components are currently in the vicinity of approximately 60–80 W and expected to reach roughly 100–120 W in the near future. This paper presents a design effort wherein a chassis has been analyzed and designed for a cooling capacity on the order of 600 W for the board to the extent that one is able to cool about 80 W for the ASICs and other components on the board.

Copyright © 2003 by ASME

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