Full Content is available to subscribers

Subscribe/Learn More  >

Design Optimization of LTCC Interconnects With Meshed Ground Planes

[+] Author Affiliations
Lai L. Wai, Albert Chee W. Lu, Wei Fan, Lin Jin

Singapore Institute of Manufacturing Technology, Singapore

Lee A. Low

DSO National Laboratories, Singapore

Paper No. IPACK2003-35155, pp. 7-12; 6 pages
  • ASME 2003 International Electronic Packaging Technical Conference and Exhibition
  • 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 2
  • Maui, Hawaii, USA, July 6–11, 2003
  • Conference Sponsors: Electronic and Photonic Packaging Division
  • ISBN: 0-7918-3690-8 | eISBN: 0-7918-3674-6
  • Copyright © 2003 by ASME


Coupling between interconnects in high density structures limits the broadband performance, leading to degradation in insertion loss and cross talk characteristics. This paper describes the solution space analysis of LTCC interconnects with meshed planes. The impact of metal coverage, interconnect structures and mesh geometry was evaluated through detailed 3-D FEM based simulations.

Copyright © 2003 by ASME



Interactive Graphics


Country-Specific Mortality and Growth Failure in Infancy and Yound Children and Association With Material Stature

Use interactive graphics and maps to view and sort country-specific infant and early dhildhood mortality and growth failure data and their association with maternal

Citing articles are presented as examples only. In non-demo SCM6 implementation, integration with CrossRef’s "Cited By" API will populate this tab (http://www.crossref.org/citedby.html).

Some tools below are only available to our subscribers or users with an online account.

Related Content

Customize your page view by dragging and repositioning the boxes below.

Related eBook Content
Topic Collections

Sorry! You do not have access to this content. For assistance or to subscribe, please contact us:

  • TELEPHONE: 1-800-843-2763 (Toll-free in the USA)
  • EMAIL: asmedigitalcollection@asme.org
Sign In