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Design Optimization of LTCC Interconnects With Meshed Ground Planes

[+] Author Affiliations
Lai L. Wai, Albert Chee W. Lu, Wei Fan, Lin Jin

Singapore Institute of Manufacturing Technology, Singapore

Lee A. Low

DSO National Laboratories, Singapore

Paper No. IPACK2003-35155, pp. 7-12; 6 pages
doi:10.1115/IPACK2003-35155
From:
  • ASME 2003 International Electronic Packaging Technical Conference and Exhibition
  • 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 2
  • Maui, Hawaii, USA, July 6–11, 2003
  • Conference Sponsors: Electronic and Photonic Packaging Division
  • ISBN: 0-7918-3690-8 | eISBN: 0-7918-3674-6
  • Copyright © 2003 by ASME

abstract

Coupling between interconnects in high density structures limits the broadband performance, leading to degradation in insertion loss and cross talk characteristics. This paper describes the solution space analysis of LTCC interconnects with meshed planes. The impact of metal coverage, interconnect structures and mesh geometry was evaluated through detailed 3-D FEM based simulations.

Copyright © 2003 by ASME

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