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Use of Electrochemical Techniques in CMP Process Evaluation

[+] Author Affiliations
Vlasta Brusic

Cabot Microelectronics, Aurora, IL

Paper No. WTC2005-64134, pp. 497-498; 2 pages
doi:10.1115/WTC2005-64134
From:
  • World Tribology Congress III
  • World Tribology Congress III, Volume 2
  • Washington, D.C., USA, September 12–16, 2005
  • Conference Sponsors: Tribology Division
  • ISBN: 0-7918-4202-9 | eISBN: 0-7918-3767-X
  • Copyright © 2005 by ASME

abstract

With the maturing of Chemical Mechanical Polishing Technology, there are many novel, imaginative and challenging applications awaiting its use. Polishing of metals such as tungsten, aluminum, and copper, has been extended to magnetic materials, noble metals, and others, often in the form of alloys of complicated compositions. As metal CMP can also be defined as corrosion enhanced by wear, electrochemical techniques remain a very practical probe into the behavior of metals in novel solutions, under a variety of conditions relevant to polishing. They can be used as a first step approach to determine if the metals will be reactive in selected slurry, what are the predominant reactions and their rate determining steps. This paper will describe several examples, mostly from new applications based on the noble metals, as well as some very practical alloys.

Copyright © 2005 by ASME

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