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Development of a Combined Analytical and Empirical Model for Beveling of Quartz Crystal Wafers

[+] Author Affiliations
Chensong (Jonathan) Dong

Rakon, Ltd., Auckland, New Zealand

Paper No. WTC2005-64254, pp. 841-842; 2 pages
doi:10.1115/WTC2005-64254
From:
  • World Tribology Congress III
  • World Tribology Congress III, Volume 1
  • Washington, D.C., USA, September 12–16, 2005
  • Conference Sponsors: Tribology Division
  • ISBN: 0-7918-4201-0 | eISBN: 0-7918-3767-X
  • Copyright © 2005 by ASME

abstract

Beveling or contouring is an important step in the processing of quartz crystal wafers used in resonators. This paper presents a combined analytical and empirical approach for contouring process modeling. Based on the bevel profile measurement the material removal mechanism is analyzed and new characteristics describing the beveling process are introduced. A process model is developed to determine the process parameters of beveling. Compared to the traditional trial-and-error approach, this approach provides a powerful tool for developing beveling methods for new crystal wafer design and beveling process optimization.

Copyright © 2005 by ASME

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