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CMP and Nano-Characterization of Magnetic Head Wafer Films

[+] Author Affiliations
Jonathan Garcia, Elon Terrell, C. Fred Higgs, III

Carnegie Mellon University, Pittsburgh, PA

Paper No. WTC2005-63704, pp. 737-738; 2 pages
  • World Tribology Congress III
  • World Tribology Congress III, Volume 1
  • Washington, D.C., USA, September 12–16, 2005
  • Conference Sponsors: Tribology Division
  • ISBN: 0-7918-4201-0 | eISBN: 0-7918-3767-X
  • Copyright © 2005 by ASME


Similar to the semiconductor sector improving processing power by decreasing device sizes, the information storage sector has been working to decrease device sizes in read/write heads. Chemical mechanical polishing (CMP) is a critical enabling technology for terabyte storage systems and other systems consisting of nanotechnology. A commercial CMP polisher was used, and the experimental material removal rates (MRR) are presented. Since the MRR is a function of the load, relative speed, and film hardness, a nano-indention technique was employed to characterize mechanical properties of the permalloy (NiFe) films. A basic MRR model was developed to compare to the experimental results.

Copyright © 2005 by ASME



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