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The Influence of Residual Stress on Micromachine Stiction of a Stiff Circular Plate

[+] Author Affiliations
Ming-Fung Wong, Kai-Tak Wan

University of Missouri at Rolla, Rolla, MO

Lior Kogut

University of Western Ontario, London, ON, Canada

Paper No. WTC2005-63280, pp. 247-248; 2 pages
doi:10.1115/WTC2005-63280
From:
  • World Tribology Congress III
  • World Tribology Congress III, Volume 1
  • Washington, D.C., USA, September 12–16, 2005
  • Conference Sponsors: Tribology Division
  • ISBN: 0-7918-4201-0 | eISBN: 0-7918-3767-X
  • Copyright © 2005 by ASME

abstract

The notorious coupling of adhesion and residual membrane stress on the bridge of a MEMS-RF-switch and its effects on stiction failure are investigated. The previous model [1] of a thin flexible circular membrane with zero stiffness is here extended to thick stiff plate under bending. The mechanics of a film delaminating from a substrate is rigorously constructed based on an energy balance.

Copyright © 2005 by ASME
Topics: Stress , Stiction

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