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Tribo-Electric Behaviors of Copper Under Dry Sliding Against Cu-Cr Alloys

[+] Author Affiliations
Yongzhen Zhang, Ming Qiu, Lemin Sun, Yue Chen, Bao Shangguan

Henan University of Science and Technology, Luoyang, Henan, P. R. China

Paper No. WTC2005-63095, pp. 203-204; 2 pages
  • World Tribology Congress III
  • World Tribology Congress III, Volume 1
  • Washington, D.C., USA, September 12–16, 2005
  • Conference Sponsors: Tribology Division
  • ISBN: 0-7918-4201-0 | eISBN: 0-7918-3767-X
  • Copyright © 2005 by ASME


The tribological and electrical conduction behaviors of copper under dry sliding against copper-chromium alloys were investigated on the basis of simulation tests. The experimental results show that electrical current and tribological parameters have combined effects on both electrical conduction ability and tribological properties. High sliding velocity and electrical current density deteriorate both the tribological and electrical conduction properties in tribo-electrical sliding system. In the end, the worn surface analysis suggests that friction, resistance heat and electrical arc spoiling are the main factors to influence the tribological and electrical conduction properties.

Copyright © 2005 by ASME
Topics: Copper , Alloys



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