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Thermal Simulation and Experimental Validation for TEC Design

[+] Author Affiliations
Peter Shi, Stephen Wong, Yeow Meng Tan, Vasudivan Sunappan, Wei Fan, Kai Meng Chua

Singapore Institute of Manufacturing Technology, Singapore

Bill Freeman, Hongjin Jiang

Trans-Thermal Corporation Pte Ltd.

Paper No. IPACK2005-73309, pp. 2173-2178; 6 pages
doi:10.1115/IPACK2005-73309
From:
  • ASME 2005 Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems collocated with the ASME 2005 Heat Transfer Summer Conference
  • Advances in Electronic Packaging, Parts A, B, and C
  • San Francisco, California, USA, July 17–22, 2005
  • Conference Sponsors: Heat Transfer Division and Electronic and Photonic Packaging Division
  • ISBN: 0-7918-4200-2 | eISBN: 0-7918-3762-9
  • Copyright © 2005 by ASME

abstract

We proposed a methodology for simulation and design of thermoelectric coolers based on the energy balance among the Peltier heat, Joule heat, conduction heat, radiation heat and convection heat and by using the Computational Fluid Dynamics software. Thermal index was proposed for easy prediction of a TEC module efficiency. The prototype of the TEC module was fabricated after the design optimization. Experimental validation was performed by using a thermal characterization system including a chiller and a thermal analyzer. It was found that the simulation and experimental results agreed well.

Copyright © 2005 by ASME
Topics: Simulation , Design

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