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Superlattice Thermoelectrics for Thermal Management of Electronics and Optoelectronics

[+] Author Affiliations
R. Venkatasubramanian, B. O’Quinn, R. Alley, E. Siivola, M. Soto

Nextreme Thermal Solutions, Research Triangle Park, NC

A. Reddy, P. Addepalli

RTI International, Research Triangle Park, NC

Paper No. IPACK2005-73198, pp. 2147-2152; 6 pages
  • ASME 2005 Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems collocated with the ASME 2005 Heat Transfer Summer Conference
  • Advances in Electronic Packaging, Parts A, B, and C
  • San Francisco, California, USA, July 17–22, 2005
  • Conference Sponsors: Heat Transfer Division and Electronic and Photonic Packaging Division
  • ISBN: 0-7918-4200-2 | eISBN: 0-7918-3762-9
  • Copyright © 2005 by ASME


Solid-state cooling technologies using advanced superlattice thermoelectric materials are likely to provide not only near-term solutions for the hot-spots but also scalable refrigeration solutions for the entire chip. We discuss our development efforts with the superlattice thermoelectric technology for advanced microprocessor thermal management. We also discuss the development of similar technologies for application in the thermal management of optoelectronic components. The performance of small footprint thermoelectric modules fabricated using the thin film superlattice materials are discussed. We have begun early reliability studies on the superlattice materials, devices, and modules and the early results are positive. Advanced reliability studies using full Mil-spec and Telecordia-like power cycling are being undertaken for full commercial implementation of such advanced thermoelectric components.

Copyright © 2005 by ASME



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