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Development of a Hermetically Sealed Enclosure for MEMS in Chip-on-Flex Modules Using Liquid Crystalline Polymer (LCP)

[+] Author Affiliations
Morgan Chen, Anh-Vu Pham

University of California at Davis, Davis, CA

Nicole Evers, Chris Kapusta, Joe Iannotti, William Kornrumpf

General Electric Global Research Center, Niskayuna, NY

John Maciel

Radant MEMS, Inc., Stow, MA

Nafiz Karabudak

Lockheed Martin Commercial Space Systems, Newtown, PA

Paper No. IPACK2005-73440, pp. 2057-2060; 4 pages
doi:10.1115/IPACK2005-73440
From:
  • ASME 2005 Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems collocated with the ASME 2005 Heat Transfer Summer Conference
  • Advances in Electronic Packaging, Parts A, B, and C
  • San Francisco, California, USA, July 17–22, 2005
  • Conference Sponsors: Heat Transfer Division and Electronic and Photonic Packaging Division
  • ISBN: 0-7918-4200-2 | eISBN: 0-7918-3762-9
  • Copyright © 2005 by ASME

abstract

We present the development of a hermetic shield packaging enclosure for RF microelectromechanical system switches (MEMS) using Liquid Crystal Polymer (LCP). A cavity formed in LCP has been laminated, at low temperature, onto a Si MEMS switch to create a hermetically sealed package. The hermetically sealed enclosure is a stack-up layer of the multi-layer organic chip-on-flex system-on-a-package (SOP). The entire SOP hermetically sealed package has a total insertion loss of ∼0.5 dB at X-band. E595 outgas tests demonstrate that the LCP package is reliable and hermetically protects the MEMS switch.

Copyright © 2005 by ASME

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