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Wafer Level Micropackaging for RF MEMS Switches

[+] Author Affiliations
David I. Forehand, Charles L. Goldsmith

MEMtronics Corporation, Plano, TX

Paper No. IPACK2005-73398, pp. 2047-2051; 5 pages
  • ASME 2005 Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems collocated with the ASME 2005 Heat Transfer Summer Conference
  • Advances in Electronic Packaging, Parts A, B, and C
  • San Francisco, California, USA, July 17–22, 2005
  • Conference Sponsors: Heat Transfer Division and Electronic and Photonic Packaging Division
  • ISBN: 0-7918-4200-2 | eISBN: 0-7918-3762-9
  • Copyright © 2005 by ASME


Wafer-level micro-encapsulation is an innovative, low-cost, wafer-level packaging method for encapsulating RF MEMS switches. This zero-level packaging technique has demonstrated 0.04 dB package added insertion loss at 35 GHz. This article overviews the processes, measurements, and testing methods used for determining the integrity and performance of individual encapsulated RF MEMS packages.

Copyright © 2005 by ASME



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