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An Evaluation of Auxiliary Part Configuration in the Micro Flow Sensor by Using Micro PIV

[+] Author Affiliations
Daichi Suzuki, Takashi Nagumo, Shinji Honami

Tokyo University of Science, Tokyo, Japan

Shoji Kamiunten

Yamatake Corporation, Japan

Paper No. IPACK2005-73194, pp. 2011-2015; 5 pages
  • ASME 2005 Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems collocated with the ASME 2005 Heat Transfer Summer Conference
  • Advances in Electronic Packaging, Parts A, B, and C
  • San Francisco, California, USA, July 17–22, 2005
  • Conference Sponsors: Heat Transfer Division and Electronic and Photonic Packaging Division
  • ISBN: 0-7918-4200-2 | eISBN: 0-7918-3762-9
  • Copyright © 2005 by ASME


The paper describes the configuration effects of the auxiliary parts on the flow behavior around the microfluidic device. Recent development of the devices in MEMS is noticeable. The devices are manufactured in more complicated configuration and arrangement with the auxiliary part for the requirement of higher performance. An evaluation of the flow field around the microfluidic device is strongly required in MEMS design. The aim of the paper is to clarify the effect of the auxiliary part arrangement on the flow field around the micro flow sensor which has both the sensing element and the auxiliary parts such as the pins, pillars and electric bonding wires. The flow around the sensor is measured by using the Micro Particle Image Velocimetry (PIV) system. We investigate four types of the micro flow sensor with different configuration and arrangement of the pin, the bonding wires and the pillars. The result shows that the effect of the supporting pillars is negligible.

Copyright © 2005 by ASME
Topics: Flow sensors



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