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Integrated Passives for Commercial Wireless Applications (Invited Paper)

[+] Author Affiliations
Rashaunda M. Henderson, Michael F. Petras

Freescale Semiconductor, Inc., Tempe, AZ

Paper No. IPACK2005-73499, pp. 1995-1998; 4 pages
doi:10.1115/IPACK2005-73499
From:
  • ASME 2005 Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems collocated with the ASME 2005 Heat Transfer Summer Conference
  • Advances in Electronic Packaging, Parts A, B, and C
  • San Francisco, California, USA, July 17–22, 2005
  • Conference Sponsors: Heat Transfer Division and Electronic and Photonic Packaging Division
  • ISBN: 0-7918-4200-2 | eISBN: 0-7918-3762-9
  • Copyright © 2005 by ASME

abstract

This paper discusses the modeling, design and performance of inductors and capacitors fabricated in high density interconnect (HDI), low temperature co-fired ceramic (LTCC) and silicon (Si) integrated circuit technologies. Scalable models demonstrate the capability of designing LC-based resonators and filters for use in cellular front-end modules. The performance of the circuits is presented along with size comparisons.

Copyright © 2005 by ASME

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