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Evaluation of Spiral Inductors Embedded in Low Temperature Co-Fired Ceramic Substrates

[+] Author Affiliations
Woon Choi

Fukuoka Industry, Science and Technology Foundation, Fukuoka, Japan

Shintaro Ono, Hajime Tomokage

Fukuoka University, Fukuoka, Japan

Seiichiro Yoshida

Saga Electronics Company, Ltd., Saga, Japan

Paper No. IPACK2005-73469, pp. 1989-1993; 5 pages
doi:10.1115/IPACK2005-73469
From:
  • ASME 2005 Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems collocated with the ASME 2005 Heat Transfer Summer Conference
  • Advances in Electronic Packaging, Parts A, B, and C
  • San Francisco, California, USA, July 17–22, 2005
  • Conference Sponsors: Heat Transfer Division and Electronic and Photonic Packaging Division
  • ISBN: 0-7918-4200-2 | eISBN: 0-7918-3762-9
  • Copyright © 2005 by ASME

abstract

In order to obtain full information on the high frequency performance of embedded passive elements, we design test elements group (TEG) substrates and compare the simulation result with measured data. S-parameters of spiral inductors embedded in low temperature co-fired ceramic (LTCC) substrates are simulated using high frequency structure simulator (HFSS), microwave studio (MWS) and advanced design simulator (ADS). Then effective inductance and Q factors are calculated from S-parameters after de-embedding process. Measurements of S-parameters are performed using a vector network analyzer in the frequency range up to 15 GHz. The simulation result with dimensional data measured by laser microscope and X-lay microscope is in good agreement with the experimental result. It is suggested that the simulation results can be applied to the design of system-in-a-package (SiP) substrate directly without making TEG.

Copyright © 2005 by ASME

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