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Power Distribution Analysis of Multi-Layer Substrates With Power Decoupling Capacitors

[+] Author Affiliations
Albert Chee Wai Lu, Lin Jin, Kai M. Chua, Wei Fan, Lai L. Wai

Singapore Institute of Manufacturing Technology, Singapore

Paper No. IPACK2005-73347, pp. 1985-1988; 4 pages
  • ASME 2005 Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems collocated with the ASME 2005 Heat Transfer Summer Conference
  • Advances in Electronic Packaging, Parts A, B, and C
  • San Francisco, California, USA, July 17–22, 2005
  • Conference Sponsors: Heat Transfer Division and Electronic and Photonic Packaging Division
  • ISBN: 0-7918-4200-2 | eISBN: 0-7918-3762-9
  • Copyright © 2005 by ASME


This paper describes power distribution design and analysis for multi-layer LTCC (low temperature co-fired ceramic) substrates intended for broadband digital applications. Both land side discrete capacitor (LSC, i.e. mounted on the bottom) and top side discrete capacitor (TSC, i.e. mounted on the top or the same side as the active device) configurations were compared in terms of impedance characteristics up to 3 GHz, with respect to different port locations for the active device. Full-wave electromagnetic modeling was carried out to study the impedance characteristics and good correlation with vector network analyzer measurements was achieved. At lower frequencies well below the self-resonant frequency of the intrinsic power plane, the effective impedance is dominated by the series effective inductance. It was observed that the LSC configuration achieves lower impedance due to a reduced series effective inductance since the TSC configuration results in a longer low frequency impedance path. At higher frequencies, however, the LSC configuration actually results in an impedance peak at a lower frequency due to the parallel resonance attributed to the power planes.

Copyright © 2005 by ASME



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