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Analysis and Characterization of Embedded Resistors for Wideband Applications

[+] Author Affiliations
Albert C. W. Lu, L. L. Wai, W. Fan, Stephen C. K. Wong

Singapore Institute of Manufacturing Technology, Singapore

Toshio Yamazaki, Jacinto Jun Jarcia, Jr., Kim H. Chin

Hitachi Chemical (Singapore) Pte Ltd., Singapore

Paper No. IPACK2005-73345, pp. 1979-1984; 6 pages
  • ASME 2005 Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems collocated with the ASME 2005 Heat Transfer Summer Conference
  • Advances in Electronic Packaging, Parts A, B, and C
  • San Francisco, California, USA, July 17–22, 2005
  • Conference Sponsors: Heat Transfer Division and Electronic and Photonic Packaging Division
  • ISBN: 0-7918-4200-2 | eISBN: 0-7918-3762-9
  • Copyright © 2005 by ASME


This paper will describe the high-frequency analysis and characterization of embedded resistors fabricated in organic substrates. Although embedded resistors have been widely used in organic substrates, detailed analysis and characterization at high frequencies have received very limited attention. Majority of previous research work focuses on low frequency performance and manufacturing considerations. In this research work, a novel embedded resistor fabrication technique was employed to allow design on demand implementation of resistors. Analysis and characterization were carried out for frequencies up to 20 GHz, along with a comparison between embedded resistors and discrete surface mount resistors. It can be deduced that the degraded performance in the discrete implementation occurs above 1 GHz and is mainly attributed to surface mount parasitics. Embedded resistors, in contrast, offer significantly better broadband performance up to 20 GHz, in spite of inferior tolerances within 20%. This results show that embedded resistors not only achieve improved area utilization but also greatly improved high-frequency performance.

Copyright © 2005 by ASME
Topics: Resistors



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