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Integration of RF Inductors and Baluns in Multilayer Organic Substrates

[+] Author Affiliations
Telesphor Kamgaing, Kyu-Pyung Hwang, Jiangqi He, Rockwell Hsu, Yongki Min

Intel Corporation, Chandler, AZ

Chee Hoo Lee

Intel Corporation, Penang, Malaysia

Xiang Yin Zeng

Intel Corporation, Shanghai, China

Jae-Yong Ihm

University of Illinois at Urbana-Champaign, Urbana, IL

Paper No. IPACK2005-73316, pp. 1973-1977; 5 pages
doi:10.1115/IPACK2005-73316
From:
  • ASME 2005 Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems collocated with the ASME 2005 Heat Transfer Summer Conference
  • Advances in Electronic Packaging, Parts A, B, and C
  • San Francisco, California, USA, July 17–22, 2005
  • Conference Sponsors: Heat Transfer Division and Electronic and Photonic Packaging Division
  • ISBN: 0-7918-4200-2 | eISBN: 0-7918-3762-9
  • Copyright © 2005 by ASME

abstract

This paper discusses the design, modeling and characterization of RF inductors and baluns in a multilayer organic substrate. In the first part of the paper, we systematically look at two types of spiral inductors for RF applications. More than 40 multi-turn spiral inductors covering inductance values from a few nH to 20 nH have been fabricated and fully characterized. Single turn inductors suitable for high-frequency applications with inductance values in the sub-nH range have also been fabricated and evaluated. In the second part of the paper, we discuss the design of a Marchand-type balun for 2.4 GHz Bluetooth and WLAN application. This 50:100-Ohm balun design employs staggered trace arrangement which results in improved insertion loss and robust performance. Both measurement and simulation data are presented to validate the package-embedded components.

Copyright © 2005 by ASME
Topics: Inductors

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