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Multilayer Direct-Writing of Electrical Conductors With Gold Nanoinks Using the Fountain-Pen Principle

[+] Author Affiliations
Cédric P. R. Dockendorf, Tae-Youl Choi, Dimos Poulikakos

Swiss Federal Institute of Technology-Zurich, Zurich, Switzerland

C. P. Grigoropoulos

University of California at Berkeley, Berkeley, CA

Paper No. IPACK2005-73497, pp. 1959-1961; 3 pages
doi:10.1115/IPACK2005-73497
From:
  • ASME 2005 Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems collocated with the ASME 2005 Heat Transfer Summer Conference
  • Advances in Electronic Packaging, Parts A, B, and C
  • San Francisco, California, USA, July 17–22, 2005
  • Conference Sponsors: Heat Transfer Division and Electronic and Photonic Packaging Division
  • ISBN: 0-7918-4200-2 | eISBN: 0-7918-3762-9
  • Copyright © 2005 by ASME

abstract

Previous publications showed the potential of gold nanoparticle inks in microelectronic manufacturing. The main advantage of using nanoparticles for the production of microelectronic conductors is their low melting point. Indeed the melting point of gold nanoparticles decreases dramatically with decreasing size. This interesting property presents us with an uncomplicated way in which to produce electronic conductors on plastics, thus manufacture flexible electronics. Microelectronic applications which make use of materials other than silicon make their appearance ever more often. In this paper we present a method of manufacturing multilayered electronic circuits using a scanning-probe-inspired technology to deposit and anneal a gold nanoink on various substrates. We then tested the quality of this technology by applying it to a real complete electronic circuit.

Copyright © 2005 by ASME

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