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Self-Assembly for Three Dimensional Integration of Functional Electrical Components

[+] Author Affiliations
Andrew H. Cannon, Yueming Hua, Clifford L. Henderson, William P. King

Georgia Institute of Technology, Atlanta, GA

Paper No. IPACK2005-73325, pp. 1943-1948; 6 pages
doi:10.1115/IPACK2005-73325
From:
  • ASME 2005 Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems collocated with the ASME 2005 Heat Transfer Summer Conference
  • Advances in Electronic Packaging, Parts A, B, and C
  • San Francisco, California, USA, July 17–22, 2005
  • Conference Sponsors: Heat Transfer Division and Electronic and Photonic Packaging Division
  • ISBN: 0-7918-4200-2 | eISBN: 0-7918-3762-9
  • Copyright © 2005 by ASME

abstract

Current microelectronics manufacturing and packaging rely on pick-and-place methods, a serial manufacturing process. Self-Assembly (SA) is a parallel manufacturing process that can be three dimensional and as such could improve the manufacture of systems that require diverse integration of sensors, actuators, electronics, and power sources. This paper describes SA of millimeter-scale parts in which functional electronic components and electrical interconnects were cast into 5 mm cubes of Polymethylmethacrylate (PMMA). Surface forces induced both gross and fine alignment of the cubes. The cubes were bonded using low-melting temperature solder (47°C), resulting in a self-assembled three dimensional circuit. This technique could be expanded for assembly of systems having more than 104 components. The ultimate goal is to combine a large number of diverse active components to allow the manufacture of systems having dense integrated functionality.

Copyright © 2005 by ASME

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