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Subtractive Laser Processing of Low Temperature Inkjet Printed Micro Electric Components of Functional Nano-Ink for Flexible Electronics

[+] Author Affiliations
Seung Hwan Ko, Yeonho Choi, David J. Hwang, Costas P. Grigoropoulos

University of California at Berkeley, Berkeley, CA

Jaewon Chung

Korea University, Seoul, Korea

Dimos Poulikakos

ETH, Zurich, Switzerland

Paper No. IPACK2005-73186, pp. 1935-1941; 7 pages
  • ASME 2005 Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems collocated with the ASME 2005 Heat Transfer Summer Conference
  • Advances in Electronic Packaging, Parts A, B, and C
  • San Francisco, California, USA, July 17–22, 2005
  • Conference Sponsors: Heat Transfer Division and Electronic and Photonic Packaging Division
  • ISBN: 0-7918-4200-2 | eISBN: 0-7918-3762-9
  • Copyright © 2005 by ASME


The low temperature fabrication of electrical components on flexible substrate is presented in this paper. As an additive process, combined with a CAD tool, a drop-on-demand (DOD) inkjetting system was used to print electrical components from gold nano-particles suspended in Alpha-Terpineol solution on flexible polymer substrates. In a subtractive process, Nd:YAG pulsed laser was irradiated to produce finer electrical components. Continuous Ar laser was irradiated locally to evaporate carrier solution as well as to sinter gold nanoparticles. It is demonstrated for the first time, that the melting temperature depression of gold nanoink, combined with local laser heating and ablation can be used to fabricate micro electric components on low melting temperature polymer substrate to realize flexible electronics.

Copyright © 2005 by ASME



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