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Future Direction and Challenges for Microelectronics Packaging Materials

[+] Author Affiliations
Vijay Wakharkar, J. C. Matayabas, Jr.

Intel Corporation, Chandler, AZ

Paper No. IPACK2005-73374, pp. 1875-1880; 6 pages
doi:10.1115/IPACK2005-73374
From:
  • ASME 2005 Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems collocated with the ASME 2005 Heat Transfer Summer Conference
  • Advances in Electronic Packaging, Parts A, B, and C
  • San Francisco, California, USA, July 17–22, 2005
  • Conference Sponsors: Heat Transfer Division and Electronic and Photonic Packaging Division
  • ISBN: 0-7918-4200-2 | eISBN: 0-7918-3762-9
  • Copyright © 2005 by ASME

abstract

The continual increasing performance of microelectronics products places a high demand on packaging technologies. This presentation will discuss the current environment, challenges, and technologies being pursued. Package technology migrations for microprocessors and communication products are described. Material needs for high thermal dissipation, high-speed signaling, and high-density interconnects are discussed. Microprocessor scaling for increased performance and reduced cost places significant challenges on power delivery and power removal due to reducing dimensions, operating voltages, and increasing power. Meeting these challenges indicates a need for advanced packaging solutions using advanced materials. New methodologies, metrologies, and materials/process technologies to address these challenges are also highlighted.

Copyright © 2005 by ASME

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