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Loading Rate Effect Investigation of Through-Hole-Mounted Solder Joints

[+] Author Affiliations
Frank Z. Liang, Larry M. Palanuk, Mike Gabriel

Intel Corporation, Hillsboro, OR

Paper No. IPACK2005-73275, pp. 1857-1862; 6 pages
  • ASME 2005 Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems collocated with the ASME 2005 Heat Transfer Summer Conference
  • Advances in Electronic Packaging, Parts A, B, and C
  • San Francisco, California, USA, July 17–22, 2005
  • Conference Sponsors: Heat Transfer Division and Electronic and Photonic Packaging Division
  • ISBN: 0-7918-4200-2 | eISBN: 0-7918-3762-9
  • Copyright © 2005 by ASME


This paper presents two simple and unique tests to extract shock-level loading limits for eutectic and lead free solders. A wide range of loading rates, from quasi-static to high speed, was applied to a through-hole-mounted anchor assembly test coupon. The high speed shock tests were conducted on a drop shock table where the impacting velocities were derived through table input adjustments. The quasi-static tests were done using controlled hydraulic linear actuator with a load cell. As would be assumed, the dynamic load to cause solder joint failure was found to increase with higher loading rate. However, at such a high loading rate range, the impact velocity did not change the load to failure. This study leads to an interesting hypothesis that at high loading rates, the solder joint strain rate may not see a significant change as observed at low rates.

Copyright © 2005 by ASME
Topics: Solder joints



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