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Numerical Model to Analyse IC Chip Encapsulation Process

[+] Author Affiliations
Venkatesh M. Kulkarni, Ishak Abdul Azid, K. N. Seetharamu, P. A. Aswatha Narayana

University of Science Malaysia, Penang, Malaysia

Paper No. IPACK2005-73197, pp. 1841-1848; 8 pages
doi:10.1115/IPACK2005-73197
From:
  • ASME 2005 Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems collocated with the ASME 2005 Heat Transfer Summer Conference
  • Advances in Electronic Packaging, Parts A, B, and C
  • San Francisco, California, USA, July 17–22, 2005
  • Conference Sponsors: Heat Transfer Division and Electronic and Photonic Packaging Division
  • ISBN: 0-7918-4200-2 | eISBN: 0-7918-3762-9
  • Copyright © 2005 by ASME

abstract

In this paper, simulation of the 2D flow of incompressible molten epoxy material in a mold cavity has been carried out. Characteristic Based Split (CBS) was used in its semi-implicit form to analyze the mold filling behavior in underfilling encapsulation process. A two dimensional numerical model was developed and the governing equations were solved by using Characteristic Based Split (CBS) method to get the velocity and pressure fields. The velocity filed was used in pseudo-concentration approach to track the flow front. Pseudo-concentration is based on the Volume of Fluid (VOF) technique and was used to track fluid front for each time step. Simulation has been carried out for a particular geometry of a flip-chip package. The model proposed could provide a means to simulate the underfilling process for flip chip package.

Copyright © 2005 by ASME

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