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An Evaluation of Fatigue Damage in Low-Cycle Range for Sn-3.5Ag, Sn-0.7Cu Lead-Free Solders and Sn-Pb Eutectic Solder Using Image Processing to Surface Feature

[+] Author Affiliations
Takehiko Takahashi, Susumu Hioki

Akita Prefectural University, Honjyo, Akita, Japan

Ikuo Shohji

Gunma University, Kiryu, Japan

Osamu Kamiya

Akita University, Akita, Japan

Paper No. IPACK2005-73152, pp. 1811-1817; 7 pages
  • ASME 2005 Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems collocated with the ASME 2005 Heat Transfer Summer Conference
  • Advances in Electronic Packaging, Parts A, B, and C
  • San Francisco, California, USA, July 17–22, 2005
  • Conference Sponsors: Heat Transfer Division and Electronic and Photonic Packaging Division
  • ISBN: 0-7918-4200-2 | eISBN: 0-7918-3762-9
  • Copyright © 2005 by ASME


The low-cycle fatigue behavior of Sn-3.5mass%Ag, Sn-0.7mass%Cu lead-free solders and Sn-37mass%Pb solder were investigated at strain rate of 0.1%/s with a non-contact extensometer at room temperature (22 ± 3 °C). In addition, the relationship between the surface features in the low-cycle fatigue test and the fatigue life of those solders were investigated by image processing. The fatigue lives of Sn-3.5mass%Ag and Sn-0.7mass%Cu were better than that of Sn-37mass%Pb. The low-cycle fatigue behavior on each solder followed Coffin-Manson equation. The surface deformation in fine wrinkles was observed in the low-cycle fatigue test at each solder. The surface features for each solder were evaluated by image processing from the surface deformation. The surface features in the low-cycle fatigue test did not appear until under 10% of the fatigue life for Sn-3.5mass%Ag, until 10% of the fatigue life for Sn-0.7mass%Cu, and until 20% of the fatigue life for Sn-37mass%Pb.

Copyright © 2005 by ASME



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