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Polyimide Multi-Layer Substrate for High-Density Semiconductor Package

[+] Author Affiliations
Shoichi Takenaka, Shoji Ito, Ryoichi Kishihara, Masahiro Okamoto, Osamu Nakao

Fujikura, Ltd., Sakura, Chiba, Japan

Paper No. IPACK2005-73065, pp. 1779-1782; 4 pages
doi:10.1115/IPACK2005-73065
From:
  • ASME 2005 Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems collocated with the ASME 2005 Heat Transfer Summer Conference
  • Advances in Electronic Packaging, Parts A, B, and C
  • San Francisco, California, USA, July 17–22, 2005
  • Conference Sponsors: Heat Transfer Division and Electronic and Photonic Packaging Division
  • ISBN: 0-7918-4200-2 | eISBN: 0-7918-3762-9
  • Copyright © 2005 by ASME

abstract

We have developed a polyimide multi-layer substrate for semiconductor package. Interstitial via holes filled with conductive paste make the electrical connection in any layers in the multi-layer substrate to realize high-density wiring. The substrate shows reliable resistance to moisture and heat. Use of polyimide film make the substrate considerable thin compared to the conventional method using glass-epoxy. The present multi-layer substrate can be applied to a promising interposer for high-density semiconductor such as multi-chip module and stacked chip.

Copyright © 2005 by ASME

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