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Correlation Between Creep and Uniaxial Ratchetting of Sn/37Pb and Sn/3Ag/0.5Cu Solder Alloys

[+] Author Affiliations
Katsuhiko Sasaki, Takuji Kobayashi

Hokkaido University, Sapporo, Japan

Ken-Ichi Ohguchi

Akita University, Akita, Japan

Paper No. IPACK2005-73054, pp. 1773-1778; 6 pages
doi:10.1115/IPACK2005-73054
From:
  • ASME 2005 Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems collocated with the ASME 2005 Heat Transfer Summer Conference
  • Advances in Electronic Packaging, Parts A, B, and C
  • San Francisco, California, USA, July 17–22, 2005
  • Conference Sponsors: Heat Transfer Division and Electronic and Photonic Packaging Division
  • ISBN: 0-7918-4200-2 | eISBN: 0-7918-3762-9
  • Copyright © 2005 by ASME

abstract

Ratchetting deformations of solder alloys are significant deformations for the safety and reliability of solder joints of electronic packaging. This paper discusses a correlation between creep and uniaxial ratchetting deformations to clarify the difference in the time-dependent deformations between lead-free and lead-containing solder alloys. Uniaxial ratchetting tests are conducted by cyclic tension-compression and cyclic tension-unloading with the several ratios of maximum to minimum stresses. Additional creep tests are also conducted after the uniaxial ratchetting tests to clarify the effect of the uniaxial ratchetting on the creep deformation. A method to evaluate the uniaxial ratchetting deformation is discussed using the creep curves. The results show that the uniaxial ratchetting deformation correlates to the creep deformation and that the correlation is different between the lead-free and lead-containing solder alloys.

Copyright © 2005 by ASME
Topics: Creep , Alloys , Solders

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