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Design of Transducer and Package at the Same Time

[+] Author Affiliations
Gary Li, Andrew McNeil, Dan Koury, Mike Chapman, Dave Monk

Freescale Semiconductor, Inc., Tempe, AZ

Paper No. IPACK2005-73396, pp. 1761-1765; 5 pages
  • ASME 2005 Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems collocated with the ASME 2005 Heat Transfer Summer Conference
  • Advances in Electronic Packaging, Parts A, B, and C
  • San Francisco, California, USA, July 17–22, 2005
  • Conference Sponsors: Heat Transfer Division and Electronic and Photonic Packaging Division
  • ISBN: 0-7918-4200-2 | eISBN: 0-7918-3762-9
  • Copyright © 2005 by ASME


The early effort of MEMS sensor development was focused mainly on the transducer: designing and manufacturing a mechanical device that could convert a physical input into an electrical signal using traditional semiconductor processes. With the rapid advancement in MEMS technologies, MEMS packaging is becoming increasingly critical and plays a major role in the successful commercialization of a MEMS product. Freescale has adopted the philosophy [1–2] of concurrent transducer and package designs to facilitate the rapid introduction of sensor products into the market. This paper presents a sub-modeling procedure that allows the modeling and simulation of a transducer and a package seamless at the same time.

Copyright © 2005 by ASME
Topics: Design , Transducers



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