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Acoustic Microscopy for Micro Electrical Interconnections

[+] Author Affiliations
Hironori Tohmyoh, Tsuyoshi Akaogi, Masumi Saka

Tohoku University, Sendai, Japan

Paper No. IPACK2005-73061, pp. 1689-1693; 5 pages
  • ASME 2005 Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems collocated with the ASME 2005 Heat Transfer Summer Conference
  • Advances in Electronic Packaging, Parts A, B, and C
  • San Francisco, California, USA, July 17–22, 2005
  • Conference Sponsors: Heat Transfer Division and Electronic and Photonic Packaging Division
  • ISBN: 0-7918-4200-2 | eISBN: 0-7918-3762-9
  • Copyright © 2005 by ASME


This paper describes on acoustic microscopy for evaluation of micro electrical interconnection. We visualize the joint interface between silicon chip and the printed circuit board by means of acoustic microscopy, and show the limitation in the evaluation of the electrical interconnection by acoustical manner. Also we design the optimum dry-coupling ultrasonic transmission system, and visualize the joint interface under a dry condition.

Copyright © 2005 by ASME
Topics: Acoustics , Microscopy



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