0

Full Content is available to subscribers

Subscribe/Learn More  >

Effect of Voids on Thermal Fatigue Reliability of Lead Free Solder Joint

[+] Author Affiliations
Doseop Kim, Qiang Yu, Yusuke Kobayashi, Tadahiro Shibutani

Yokohama National University, Yokohama, Japan

Paper No. IPACK2005-73136, pp. 1643-1648; 6 pages
doi:10.1115/IPACK2005-73136
From:
  • ASME 2005 Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems collocated with the ASME 2005 Heat Transfer Summer Conference
  • Advances in Electronic Packaging, Parts A, B, and C
  • San Francisco, California, USA, July 17–22, 2005
  • Conference Sponsors: Heat Transfer Division and Electronic and Photonic Packaging Division
  • ISBN: 0-7918-4200-2 | eISBN: 0-7918-3762-9
  • Copyright © 2005 by ASME

abstract

There have been serious debates about whether Pb should be removed from solder joints, in view of environmental problems. These debates have now developed to the extent that a remarkable movement to establish regulations for the removal of Pb has emerged, especially in European countries and Japan. Therefore, Many studies have been aggressively undertaken to develop technologies for replacing Sn-Pb solder with lead-free alternative. From the results obtained so far, it has been proven that the fatigue strength in lead-free solder joints is almost equivalent to the fatigue strength of Sn-Pb eutectic solder joints. However, a new problem is that voids are very easily formed in lead-free solder joints during the reflow process, and the effect of the voids on the fatigue strength of solder joints has attracted attention. In this study, the relationship between the voids and fatigue strength of solder joints was examined using mechanical shear fatigue test and FEM (finite element method) analysis. Using the mechanical shear fatigue test, the effect of the position and size of voids on fatigue crack initiation and crack propagation has been investigated. And quantitative evaluation of fatigue life of solder joints with the voids has been enabled by Manson-Coffin’s law and Miner’ rule.

Copyright © 2005 by ASME

Figures

Tables

Interactive Graphics

Video

Country-Specific Mortality and Growth Failure in Infancy and Yound Children and Association With Material Stature

Use interactive graphics and maps to view and sort country-specific infant and early dhildhood mortality and growth failure data and their association with maternal

NOTE:
Citing articles are presented as examples only. In non-demo SCM6 implementation, integration with CrossRef’s "Cited By" API will populate this tab (http://www.crossref.org/citedby.html).

Some tools below are only available to our subscribers or users with an online account.

Related Content

Customize your page view by dragging and repositioning the boxes below.

Related eBook Content
Topic Collections

Sorry! You do not have access to this content. For assistance or to subscribe, please contact us:

  • TELEPHONE: 1-800-843-2763 (Toll-free in the USA)
  • EMAIL: asmedigitalcollection@asme.org
Sign In